Driven by the digital economy wave, the electronic and electrical industry is undergoing an unprecedented technological revolution. From 5G communication to artificial intelligence, from the Internet of Things to consumer electronics, every innovation is inseparable from the technical support of precision manufacturing. Dongguan Zhongchuangxing Precision Machinery Manufacturing Co., LTD., as an important supplier of precision components for electronic and electrical appliances, is providing a solid manufacturing foundation for this rapidly developing industry with its profound technological accumulation.
Technical Challenges and Manufacturing Responses in the 5G Era
The brand-new requirements brought about by high frequency and high speed
Electromagnetic compatibility (EMC) challenges
The 5G frequency band has been upgraded to millimeter wave (24-100 GHZ).
The electromagnetic shielding requirement has been raised from 60dB to 80dB
The problems of resonance and crosstalk have become more prominent
Signal integrity requirements
The data transmission rate exceeds 20Gbps
Impedance control requires ±5%
Insertion loss requirement: less than 0.5dB
Thermal management challenges
The power density of the chip reaches 100W/cm²
The temperature control accuracy is ±2℃
The heat dissipation efficiency is required to be increased by 300%
The construction of our technical platform
In response to these challenges, we have established three core technology platforms:
High-frequency electromagnetic compatibility platform
Technical system
Electromagnetic simulation → Material selection → Structural design → Performance testing
Key capabilities
- Shielding effectiveness: Full frequency band coverage from 0.1 to 100GHz
- Test accuracy: ±0.5dB
- Design optimization: 30% performance improvement
2. Precision connection system platform
Process route
Contact forming → insulation assembly → performance testing → reliability verification
Technical indicators
Contact resistance: < 5mΩ
- Insertion and extraction life: > 10,000 times
- Signal rate: Supports 56Gbps
3. High-efficiency heat dissipation technology platform
Innovation path
Thermal simulation → Structural optimization → material innovation → process breakthrough
Performance objective
Thermal conductivity: > 200W/m·K
Thermal resistance: < 0.2℃/W
- Weight: Reduced by 40%
In-depth analysis of core product line technology
5G shielding components: The "Electromagnetic Guardian" of the Millimeter-wave era
Comparison of technological evolution
4G era (2.6GHz) vs. 5G Era (28GHz)
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Shielding requirement: 60dB → 80dB
Structural dimensions: λ/4=28.8mm → λ/4=2.7mm
Material thickness: 0.3mm → 0.1mm
Manufacturing accuracy: ±0.1mm → ±0.02mm
Material innovation
High-performance shielding materials
Material type, shielding effectiveness, applicable frequency band, cost
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Galvanized steel sheet: 60dB <6GHz low
Copper alloy 75dB <30GHz
The composite shielding material is 85dB <100GHz high
Conductive gasket technology
Metal wire mesh gasket: Compression ratio 30-70%
Conductive rubber: Resistance < 0.01Ω·cm
Metallized fabric: Excellent softness
Manufacturing process breakthrough
Microstructure processing
Technical parameters
Minimum hole diameter: Φ0.3mm
Array hole accuracy: Positional accuracy ±0.01mm
Hole wall roughness: Ra0.8μm
Processing efficiency: 500 holes per minute
Innovation in surface treatment
Selective electroplating process
Local silver plating: Thickness 5-10μm
Cost reduction by 40%
The electrical conductivity has been enhanced by 20%
Laser surface treatment
Surface roughness control: Ra0.2-0.8μm
Non-contact processing, no deformation
Production efficiency has increased by 300%
Typical case: 5G base station filter cavity
1. Technical requirements
Material: Aluminum alloy 6061
Dimensions: 150×120×25mm
Flatness: 0.05mm
Surface roughness: Ra0.4μm
Shielding effectiveness: > 75dB@28GHz
2. Technical challenges
Deformation during processing of thin-walled cavities
High-precision mating surface requirements
Batch production consistency
Solution
Technological innovation
Rough machining (with a allowance of 1mm) → vibration aging treatment →
Semi-finishing (with a allowance of 0.2mm) → natural aging for 24 hours →
Finishing (layer-by-layer cutting) → Laser measurement compensation
Quality control
100% three-coordinate measurement (128 measurement points)
Online laser thickness measurement (accuracy ±0.001mm)
Resonant frequency test (accuracy ±0.1MHz)
Outcome data
Dimensional accuracy: ±0.015mm
Flatness: 0.03mm (40% better than required)
Production cycle: 8 minutes per piece
Yield rate: 99.7%
2. High-speed connectors: The "toll stations" of data highways
Technical specification upgrade
USB 3.2 (20Gbps) → USB4 (40Gbps) → Future (80Gbps)
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Signal rates: 20Gbps, 40Gbps, 80Gbps
Impedance requirements: ±10%, ±7%, ±5%
Insertion loss requirements: less than 3dB, less than 1.5dB, less than 0.8dB
Manufacturing accuracy: ±0.05mm ±0.02mm ±0.01mm
Contact manufacturing technology
Material selection
Basic material: Beryllium copper C17200
Coating scheme: Nickel base layer (1-2μm)+ gold surface layer (0.5μm)
Performance indicators
Elastic modulus: 130GPa
Conductivity: 22% IACS
Contact force: 50-100
