In the wave of the information age, communication equipment, as the physical carrier of global connection, its precision manufacturing level directly determines the quality and efficiency of information transmission. Dongguan Zhongchuangxing Precision Machinery Manufacturing Co., Ltd. has been deeply engaged in the field of communication equipment manufacturing for many years, providing reliable hardware support for key facilities such as 5G base stations, microwave communication, and satellite equipment with its exquisite craftsmanship.
Technological evolution and challenges in the manufacturing of communication equipment
The technological leap from 4G to 5G
Manufacturing transformation brought about by frequency leap:
Parameter comparison: The technological impact of 4G and 5G eras
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The working frequency bands are 2.6GHz and 28/39GHz, with the accuracy requirement increased by 10 times
The bandwidth is 100MHz to 400MHz, and the signal integrity is stricter
The base station density is 1 to 20 per km², and the mass production demand has increased by 20 times
The power consumption is 2kW to 3.5kW, and the heat dissipation requirement is increased by 75%
Environmental adaptability: -40°C to 55°C, -40°C to 85°C. Higher material performance requirements
Construction of key technology platforms
1. Microwave component manufacturing platform
Technical system
Electromagnetic design → Precision machining → surface treatment → performance testing
Core competence
- Frequency range: DC-110GHz
- Machining accuracy: ±0.005mm
- Surface roughness: Ra0.2μm
- Phase consistency: ±2°
2. Base station structural component platform
Manufacturing process
Structural simulation → Mold design → Mass production → environmental verification
Technical indicators
- Dimensional accuracy: ±0.05mm
- Flatness: 0.1mm/m
- Protection grade: IP67
- Lifespan requirement: 15 years
3. Antenna array surface manufacturing platform
Process route
Radiation unit manufacturing → feed network processing → array surface integration → electrical performance testing
Performance objective
- Unit consistency: amplitude ±0.3dB, phase ±5°
- Array surface flatness: < 0.5mm
- Scanning range: ±60°
In-depth analysis of core product technology
1. Microwave component: The "Precision Heart" of Signal Processing
Technical specification evolution
Waveguide assembly, coaxial assembly, microstrip assembly
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Frequency: 8-110GHz, DC-67GHz, DC-40GHz
Loss: 0.02-0.1dB/m, 0.1-0.5dB/m, 0.3-1.0dB/m
Accuracy: ±0.003mm ±0.005mm ±0.01mm
Materials: Copper/aluminum stainless steel/Copper ceramic/polytetrafluoroethylene
Breakthroughs in waveguide manufacturing technology
Precision processing technology
Manufacturing parameters
Inner cavity dimensional tolerance: ±0.005mm
Surface roughness: Ra0.2μm
Verticality: 0.01mm/100mm
Flange flatness: 0.005mm
Special process technology
Electroforming forming technology
Wall thickness uniformity: ±0.002mm
Inner surface finish: Ra0.1μm
Production cycle: Shortened by 60%
Vacuum brazing technology
Welding strength: > 200MPa
Air tightness: Leakage rate < 1×10^-9 Pa·m³/s
Deformation control: < 0.01mm
Typical case: Ku-band waveguide filter
Technical requirements
Frequency range: 12-18GHz
Insertion loss: < 0.5dB
Out-of-band suppression: > 60dB
Power capacity: 100W average, 1kW peak
Ambient temperature: -55°C to 85°C
Technical challenges
Processing of high-Q value cavities
Temperature stability requirements
Consistency in mass production
Solution
Material innovation
Cavity material: Kovar alloy (coefficient of thermal expansion 5.5×10^-6/℃)
Tuning screw: Yin steel (coefficient of thermal expansion 1.2×10^-6/℃)
Surface coating: Silver + gold composite coating (thickness 5μm+0.5μm)
Technological innovation
Processing strategy
1. Rough machining (with a allowance of 0.5mm)
2. Aging treatment (stress relief)
3. Semi-finishing (allowance 0.1mm)
4. Low-temperature aging (150°C×8 hours)
5. Finishing (ensuring key dimensions)
6. Ultrasonic cleaning (Removing tiny burrs)
Quality control
100% three-coordinate measurement (256 measurement points)
Network analyzer testing (full-band scanning for each piece)
Temperature cycling test (-55°C to 125°C, 5 cycles)
Random vibration test (10-2000Hz, 6g RMS)
Outcome data
Electrical performance
The parameters require the actual state
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Insertion loss <0.5dB; 0.35dB is qualified
Out-of-band suppression >60dB to 65dB is qualified
Temperature stability <0.5MHz/°C; 0.3MHz/°C is qualified
Production efficiency
Processing cycle: 8 hours per piece (reduced by 40%)
First-time pass rate: 98.5%
Monthly production capacity: 500 sets
2. Base station structural components: The "solid skeleton" of Network Coverage
Technical Requirements analysis
Macro base stations and micro base stations are distributed indoors
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Dimensions: 2m³, 0.1m³, 0.01m³
Weight: 200kg, 20kg, 5kg
Protection: IP67, IP65, IP54
Heat dissipation: Air cooling/liquid cooling, natural convection
Lifespan: 15 years, 10 years, 8 years
Innovative manufacturing technology
Large cavity integral processing technology
Process parameters
Maximum processing dimensions: 2000×1500×800mm
Position accuracy: ±0.05mm
Flatness: 0.1mm/m
Wall thickness uniformity: ±0.2mm
Integrated thermal design and manufacturing
Heat dissipation solution
Topological optimization design (30% weight reduction)
2. Embedded heat pipe structure (thermal resistance reduced by 40%)
3. Surface radiation coating (25% increase in heat dissipation efficiency
4. Intelligent air duct design (20% reduction in air resistance)
Typical case: 5G macro base station AAU shell
Technical requirements
Material: Aluminum alloy 6061
Dimensions: 600×400×200mm
Weight: < 15kg
Protection grade: IP67
Heat dissipation capacity: 500W thermal power consumption, temperature rise < 30°C
Electromagnetic shielding: > 70dB
